Sensor technology
Large area pixel detector WIDEPIX with full area sensitivity composed of 100 Timepix assemblies with edgeless sensors
April 1, 2014
In this article we present the new large area device WIDEPIX composed of a matrix of 10 × 10 tiles of silicon pixel detectors Timepix (each of 256 × 256 pixels with pitch of 55 µm) having fully sensitive area of 14 .3 × 14 .3 cm2 without any gaps between the tiles. The device contains a total of 6.5 mega pixels. The first results in the field of X-ray radiography and material sensitive X-ray radiography are presented in this article.
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Processing and characterization of edgeless radiation detectors for large area detection
December 11, 2013
The polarities of the fabricated detectors on the given thicknesses were n-in-n, p-in-n, n-in-p and p-in-p. On the n-in-n and n-in-p wafers the pixel isolation was made either with a common p-stop grid or with a shallow p-spray doping. The wafer materials were high resistivity Float Zone and Magnetic Czochralski silicon with crystal orientation of <100>. In this paper, the electric properties on various types of detectors are presented. The results from spectroscopic measurement show a good energy resolution of the edge pixels, indicating an excellent charge collection near the edge pixels of the edgeless detector.
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Low-cost bump bonding activities at CERN
November 19, 2010
This paper deals with reducing the cost of flip chip of silicon pixel detectors. The focus is set in testing of Electroless- Nickel – Immersion Gold (ENIG) UBM process on top of different aluminium metallization and its soldering yield. In addition novel solder ball placement technique has been tested directly on the ENIG UBM pads.
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