M.Sc. Sami Vähänen
Sami’s core competence is flip chip processing and thin film technologies. His educational background is in materials science (Tampere University of Technology) and microelectronics manufacturing. During the past 10 years he has been working at an imaging technology company with responsibility of micro packaging activities, at VTT as a hybrid integration expert, at CERN as a detector packaging consultant and cost optimizer and just before Advacam at VTT as a team manager of 3D integration technologies at VTT. Currently Sami is CTO of Advacam and he is responsible for the flip chip processing.